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Latest publications
Editors:
Prof. Victor Veliadis and Dr. Arash Salemi
Online since:
September 2025
Description:
This special edition combines issues related to the reliability and stability of silicon carbide-based electronic devices with an analysis of engineering solutions for their applications in frontier technologies and extreme conditions, providing readers with a comprehensive overview of current advances and future directions of applications.
Editors:
Prof. Victor Veliadis and Dr. Arash Salemi
Online since:
September 2025
Description:
By integrating technological features of crystal and epitaxial layer growth, physics of defect occurrence processes and procedures for eliminating their effects, and device engineering, this edition provides a comprehensive overview of the current state of research and existing approaches to mitigating defect-related limitations in SiC-based technologies.
Editors:
Prof. Victor Veliadis and Dr. Arash Salemi
Online since:
September 2025
Description:
This special edition comprehensively overviews state-of-the-art technologies for designing structures and analysing functional characteristics of SiC-based devices and integrated circuits, which, in modern conditions of scientific and technological progress, have wide applications in many engineering and manufacturing fields.
Editors:
Prof. Citlalli Gaona-Tiburcio, Prof. Patrizia Bocchetta and Dr. Dhany Arifianto
Online since:
September 2025
Description:
The 11th issue of the journal Engineering Chemistry contains articles based on research results in materials and technologies related to environmental remediation, biomass treatment, and the formation of piezoelectric composite materials. This journal's volume will be helpful for many ecological engineering and chemical technologies specialists.
Editors:
Prof. Victor Veliadis and Dr. Arash Salemi
Online since:
September 2025
Description:
This special edition provides a comprehensive overview of the latest process enhancements that underpin the continued advancement of SiC-based device technologies by addressing methods of compound semiconductor processing and technologies of electronics device structure forming with a focus on end-device reliability.